AMD Officially Launched Its 7nm High-Performance Server CPU EPYC Rome
AMD officially announced the 7nm AMD EPYC Rome series today offering more core count, impressive class performance, efficiency, and value. This is the first high-performance data center, HPC, and AI-centric chips based on TSMC's cutting-edge 7nm process node. The latest CPU line up from AMD takes one notch higher of its Xeon rivals that still use 14nm technology.
The AMD EPYC Rome series is the descendant of the first generation AMD EPYC Naples CPUs which was launched a couple of years back. The new server series is based on the 7nm Zen 2 core technology offering 15 percent IPC increase over its predecessor. The AMD EPYC Rome series is made to provide much higher performance and much better efficiency compared to its predecessors.
At the launching event, several partners and customers joined AMD on stage to talk about the AMD EPYC Rome series and what it offers. Not only does the Zen 2 architecture provide higher performance because of a smaller manufacturing process, but it also enabled AMD to pack twice the core count and threads on AMD EPYC 7002 CPUs while maintaining higher clock speeds. The semiconductor giant also made several major changes to the CPU architecture that enables it to provide two times the throughput of the first-generation Zen.
The major features included in the AMD EPYC Rome series includes a totally redesigned execution pipeline as well as major floating-point advancements that doubled the bandwidth load or store units as well as the floating-point registers to 256-bit. One of the many important upgrades in the company's Zen 2 architecture is the doubled core density, which means that the AMD EPYC Rome series has two times the core count for every complex core or CCX.
Every AMD EPYC Rome series processor is composed of eight Zen 2 dies that are interlinked through the second generation Infinity fabric with an I/O die that serves as a core hub of the processor. Additionally, the AMD EPYC Rome series processors have 32 billion transistors on the whole package making it one of the heavily packed chip design ever made. The 7002 server lineup is composed of 19 SKUs where the AMD EPYC 7742 is part of the flagship.
All SKUs have the same Chiplet design that includes many Zen 2 dies and a single 14nm I/O die. The AMD EPYC Rome series' 7742 is the chip that would serve as the yardstick of all other server chips that will be released. It offers a crazy 128 threads and 64 cores on one package and 256 MB cache and a TDP of 225 W or up to 240W.